Title:
POLISHING COMPOSITION AND METHOD FOR MANUFACTURING SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2014000641
Kind Code:
A
Abstract:
To provide a polishing composition capable of reducing surface defects of a polishing target object composed of a crystalline metal compound, the polishing composition used in applications for polishing such a polishing target object, and a method for manufacturing a substrate using the polishing composition.
There is provided a polishing composition which contains abrasive grains and water and is used in applications for polishing a polishing target object composed of a crystalline metal compound, wherein the polishing composition further contains a surface absorbent and reduces surface defects compared with a polishing composition without containing the surface absorbent.
Inventors:
KUBO MEGUMI
MORINAGA HITOSHI
SERIKAWA MASAYUKI
MORINAGA HITOSHI
SERIKAWA MASAYUKI
Application Number:
JP2012137979A
Publication Date:
January 09, 2014
Filing Date:
June 19, 2012
Export Citation:
Assignee:
FUJIMI INC
International Classes:
B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| JP2001127020A | 2001-05-11 | |||
| JP2010023198A | 2010-02-04 | |||
| JP2004319759A | 2004-11-11 | |||
| JP2001127020A | 2001-05-11 |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda