研磨用組成物、基板の研磨方法および基板の製造方法

Title:

研磨用組成物、基板の研磨方法および基板の製造方法

Document Type and Number:

Japanese Patent JP7292844

Kind Code:

B2

Abstract:

To provide a polishing composition used in a preliminary polishing step, which is a polishing composition capable of suppressing residue of abrasive grains on a polishing object, while achieving a polishing rate suitable for preliminary polishing.SOLUTION: There is provided a polishing composition used in a preliminary polishing step. The polishing composition contains abrasive grains containing silica particles, and water. In the abrasive grain, the content rate of particles whose particle side is 45 nm or less measured by a light transmission type centrifugal sedimentation method is 10% or less, and the cumulative frequency 99% particle size (D) by the light transmission type centrifugal sedimentation method is 295 nm or more.SELECTED DRAWING: None

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Inventors:

Takahiro Oshima
Yasushi Matsunami
Noritaka Yokomichi

Application Number:

JP2018185712A

Publication Date:

June 19, 2023

Filing Date:

September 28, 2018

Export Citation:

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Assignee:

Fujimi Incorporated Co., Ltd.

International Classes:

C09K3/14; B24B1/00; B24B37/00; C09G1/02; G11B5/84

Domestic Patent References:

JP2018081733A
JP2018070870A
JP2014018923A
JP2013170119A
JP2017197693A

Attorney, Agent or Firm:

Makoto Abe
Michiko Oi
Masafumi Tani

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