Title:
研磨組成物、及びその研磨組成物を用いた研磨方法
Document Type and Number:
Japanese Patent JP6669331
Kind Code:
B2
Abstract:
Provided are a polishing composition having excellent dissolution stability and enabling a polishing process at a high polishing rate, and a polishing method using the same. The polishing composition comprises: component (A) which is composed of one or more kinds of abrasive grains selected from diamond, boron nitride, boron carbide and silicon carbide; component (B) which is composed of a fatty acid having 10 to 22 carbon atoms; component (C) which is composed of a nonionic surfactant; component (D) which is composed of an organic amine compound; and component (E) which is composed of a dispersion medium. The average particle size of the abrasive grains of the component (A) is greater than 1.0 m and smaller than or equal to 10.0 m, the content of the component (C) is 0.3 to 10 wt%, and the mole ratio of the component (D) to the component (B) [(D)/(B)] is 45/55 to 90/10. The polishing method is to polish a substrate including one or more kinds of materials selected from sapphire, silicon carbide, gallium nitride and aluminum nitride by using the polishing composition described above.
Inventors:
Hiroshi Fujimoto
Application Number:
JP2016058982A
Publication Date:
March 18, 2020
Filing Date:
March 23, 2016
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2004515609A | ||||
| JP2005288576A | ||||
| JP2011040427A | ||||
| JP2009161572A | ||||
| JP2011098396A | ||||
| JP2003082336A | ||||
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Attorney, Agent or Firm:
Tamotsu Otani