電子部品内蔵型印刷回路基板及びその製造方法

Title:

電子部品内蔵型印刷回路基板及びその製造方法

Document Type and Number:

Japanese Patent JP6669330

Kind Code:

B2

Abstract:

A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

More Like This:

JP2008091377	PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
JP2777425	[Title of the Invention] A method for manufacturing a pin grid array having a multi-stage bonding terminal structure, a device for cutting out inner layer terminals thereof, and a multilayer substrate for the pin grid array.

Inventors:

Ho-sik Park
Don-Keun Lee
Jae Hoong Choi
Sun-Jerry
Sun-Tech Rim

Application Number:

JP2015252477A

Publication Date:

March 18, 2020

Filing Date:

December 24, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Samsung Electro-Mechanics Co., Ltd.

International Classes:

H05K3/46; H01L23/12; H01L25/065; H01L25/07; H01L25/18

Domestic Patent References:

JP2000349225A
JP2009224616A
JP11220262A
JP2005303260A
JP2014086721A
JP2011159695A
JP2014003087A

Attorney, Agent or Firm:

Longhua International Patent Service Corporation

Previous Patent: 液体洗浄剤物品

Next Patent: 研磨組成物、及びその研磨組成物を用いた研磨方法