Title:
POLISHING COMPOSITION
Document Type and Number:
Japanese Patent JP2016015494
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing composition including colloidal silica, which is superior in polishing speed and settling stability.SOLUTION: A polishing composition of the present invention comprises colloidal silica. Supposing that the average aspect ratio of the colloidal silica is A (dimensionless), the particle diameter of the colloidal silica is D (in nanometers), a standard deviation of particle diameters of the colloidal silica is E (in nanometers), and the percentage by volume that particles of 1-300 nm in particle diameter account for in the colloidal silica is F (in percentage), a value determined the following expression is 350,000 or larger: A×D×E×F. In addition, particles having particle diameters of 1-300 nm account for 90% or more by volume in the colloidal silica, and particles having particle diameters of 50 nm or larger and aspect ratios of 1.2 or larger account for 50% or more by volume in the colloidal silica.
More Like This:
Inventors:
ASHITAKA KEIJI
MORINAGA HITOSHI
TAHARA MUNEAKI
MORINAGA HITOSHI
TAHARA MUNEAKI
Application Number:
JP2015153446A
Publication Date:
January 28, 2016
Filing Date:
August 03, 2015
Export Citation:
Assignee:
FUJIMI INC
International Classes:
H01L21/304; B24B37/00; C01B33/14; C09K3/14
Domestic Patent References:
| JP2009176397A | 2009-08-06 |
Foreign References:
| WO2010035613A1 | 2010-04-01 | |||
| US6334880B1 | 2002-01-01 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
Previous Patent: METHODS OF PRODUCING CONDUCTIVE PATTERNS
Next Patent: SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Next Patent: SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS