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Title:
POLISHING DEVICE OF DISCOID SUBSTRATE, BRUSH FOR POLISHING, AND DISCOID SUBSTRATE
Document Type and Number:
Japanese Patent JP2008110457
Kind Code:
A
Abstract:

To provide a polishing device further suppressing wear, etc. of a bearing by an abrasive in addition to excellent polishing of an inner periphery of a discoid substrate.

This polishing device 70 polishes an inner peripheral surface of the discoid substrate. The polishing device 70 is provided with a liquid tank 73 in which polishing liquid is put, a substrate holder 50 mounted with a plurality of sheets of the discoid substrates having openings at a center along an axial direction and provided with a mounting hole, a brush 60 inserted into the openings of the discoid substrate to polish the openings, first rotary shaft 71 and second rotary shaft 72 provided at the outside of the liquid tank 73 and provided with fixing parts fixed with each of one end and the other end of the brush 60 at positions mutually and coaxially separated in the horizontal direction, and a driving means for rotating the first rotary shaft 71 and second rotary shaft 72.


Inventors:
HANEDA KAZUYUKI
WATANABE KUNIZO
SATO YOSUKE
Application Number:
JP2006296112A
Publication Date:
May 15, 2008
Filing Date:
October 31, 2006
Export Citation:
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Assignee:
SHOWA DENKO KK
CITIZEN SEIMITSU CO LTD
International Classes:
B24B29/00; B24B5/06; B24B29/04; B24B57/02; B24B9/00
Attorney, Agent or Firm:
Jiro Kobe