To provide a polishing device and a polishing method for obtaining excellent working efficiency by controlling the tapered shape of a polished object with high accuracy.
This polishing device 1 is provided with a polishing surface table 3, a plate 5 arranged facing the polishing surface table 3, and a load applying part 7. The plate 5 holds the polished object W on the face 5a side facing the polishing surface table 3. The plate 5 is rotated relatively to the polishing surface table 3. The load applying part 7 applies a load to a predetermined position at an opposite face 5b to the face 5a, facing the polishing surface table 3, of the plate 5. The load applying part 7 has a micrometer 13, an abutting member 15 abutting on the plate 5, and a spring 17. The spring 17 is positioned between the abutting member 15 and a spindle 23 of the micrometer 13 to apply an energizing force corresponding to the moving quantity of the spindle 23, to the abutting member 15. The energizing force of the spring 17 is transmitted to the plate 5 through the abutting member 15.
MATSUMOTO TAKAO
| JPH0460976A | 1992-02-26 | |||
| JPH07314302A | 1995-12-05 | |||
| JP2002046059A | 2002-02-12 | |||
| JPH09180389A | 1997-07-11 | |||
| JPS62199355A | 1987-09-03 | |||
| JPH06131621A | 1994-05-13 | |||
| JPH0945642A | 1997-02-14 | |||
| JPH04201071A | 1992-07-22 |
Shiro Terasaki
Toyotaka Abe
Next Patent: IC ATTACHING/DETACHING TOOL