To provide a polishing device facilitating cleaning and suppressing the remaining of polishing slurry smudges, and a polishing method using the same.
A double-side polishing device 50 comprises a sun gear 21, an internal gear 22, a lower surface plate 20, an upper surface plate 30, and a slurry nozzle 151 provided on the upper surface plate 30. Below the lower surface plate 20, a bucket-shaped first slurry receiver 105 is provided so as to surround the outside of the internal gear 22. A plurality of spray nozzles 90a, 90b discharging flushing water toward an inner wall part of the internal gear 22 and the first slurry receiver 105 is provided near a bottom surface side of a side wall inner edge part of the first slurry receiver 105. Between an inner wall of the internal gear 22 and a lower surface plate receiving portion 20B of the lower surface plate 20, a plurality of spray nozzles 91a, 91b disposed so as to discharge flushing water toward the inner wall of the internal gear 22 and the lower surface plate receiving portion 20B of the lower surface plate 20 is provided.
| WO/2020/196162 | COMPOSITION FOR POLISHING SEMICONDUCTOR WIRING |
| JP2008124222 | POLISHING SOLUTION |
| WO/2003/071593 | POLISHING METHOD AND POLISHING FLUID |
Osamu Suzawa
Kazuhiko Miyasaka