Title:
POLISHING DEVICE PROVIDED WITH WORK POSITIONING MECHANISM
Document Type and Number:
Japanese Patent JP2704585
Kind Code:
B2
Abstract:
PURPOSE: To improve the matching precision between the center of gravity of a work and the center of a top ring by providing a work placing table, a position matching mechanism for centering and orientation flat (orifla) matching and a moving mechanism of a top ring or a work placing table.
CONSTITUTION: A wafer W taken out from a housing portion 36 by a work placing device 34 is sucked and held in a top ring holding portion 1 by moving the top ring. Next, the wafer W is transferred to a positioning mechanism 21 and placed on a work placing table 27 (hereinafter, referred to as a table). The wafer W is pressed by extending a centering arm 29a, and an orientation flat portion Wa is detected by an orientation flat portion detecting sensor 31 and positioned. The wafer W is held by a sucking portion of a table 27, a table center P and a wafer center O are matched to each other, moreover the top ring center and a wafer center of gravity G are matched to each other by moving the top ring holding portion 1.
Inventors:
Koichi Tanaka
Hiromasa Hashimoto
Yasuo Inada
Nakajima Makoto
Hiromasa Hashimoto
Yasuo Inada
Nakajima Makoto
Application Number:
JP35011592A
Publication Date:
January 26, 1998
Filing Date:
December 04, 1992
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
Fujikoshi Machine Industry Co., Ltd.
Fujikoshi Machine Industry Co., Ltd.
International Classes:
B24B37/00; B24B37/04; B24B37/30; B24B41/06; H01L21/304; (IPC1-7): B24B37/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP1177941A | ||||
| JP1228773A |
Attorney, Agent or Firm:
Akimoto Teruo
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