To provide a polishing device capable of controlling a pressure of a correcting tool applied to a polishing board without boring the tool.

The polishing device 20 comprises a polishing board 22 for polishing a workpiece, the disklike correcting tool 26 for correcting the surface shape of the polishing board 22, and a driving roller 60 for applying torque to an outer peripheral surface of the correcting tool 26 to rotate the tool 26. The device is equipped with a liquid reservoir 103 having an upper surface of the correcting tool 26 as a bottom. The pressure of the correcting tool 26 applied to the polishing board 22 is controlled by an amount of a liquid put in the reservoir 103.