Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
磨き装置
Document Type and Number:
Japanese Patent JP5475860
Kind Code:
B1
More Like This:
JPH07454[Name of device] Tape pasting device
JP2000176824SURFACE TREATMENT METHOD OF SUPPORTING BODY FOR PRINTING PLATE
WO/2000/027584METHOD AND APPARATUS FOR IMPROVED SEMICONDUCTOR WAFER POLISHING
Inventors:
Kawashima Mamoru
Application Number:
JP2012285228A
Publication Date:
April 16, 2014
Filing Date:
December 27, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Kawachu Co., Ltd.
International Classes:
B24B29/00; B24B5/22
Domestic Patent References:
JPS6052244A1985-03-25
JPS5210994A1977-01-27
JPS5030316B11975-09-30
JPS522689U1977-01-10
JPS5930654A1984-02-18
JPH0733549U1995-06-20
Attorney, Agent or Firm:
Yasutaka Kitagawa



 
Previous Patent: JPS5475859

Next Patent: TREATMENT OF OIL-CONTAINING WASTE WATER