Title:
研磨装置及び研磨方法
Document Type and Number:
Japanese Patent JP6652369
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device that has a most efficient support mechanism for a shaft with respect to the sum of frictional resistance force by polishing and a resistance generation direction, and a polishing method.SOLUTION: A polishing device 1 is configured to hold a lens 100 with an upper shaft 12, oscillate the upper shaft 12 so that an angle formed by a rotary shaft of a tool 20 mounted on a lower shaft 21 and a rotary shaft of the lens 100 continuously varies, and rub a processed surface of the lens 100 and a processing surface of the tool 20 together so as to polish the lens 100, while rotationally driving the lower shaft 21, which comprises a support mechanism 5A including a roller 35A which keeps one direction in a horizontal direction to regulate a movement of the upper shaft 12 relative to the one direction and supports the upper shaft 12 while maintaining flexibility of the upper shaft 12 in a shaft movable direction.SELECTED DRAWING: Figure 1
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Inventors:
Genichiro Hagiwara
Hiroyuki Seki
Hiroyuki Seki
Application Number:
JP2015226126A
Publication Date:
February 19, 2020
Filing Date:
November 18, 2015
Export Citation:
Assignee:
Olympus Endo Technology America Inc.
International Classes:
B24B13/00; B24B13/02
Domestic Patent References:
| JP10151556A | ||||
| JP2013226620A | ||||
| JP2007210074A | ||||
| JP60108820U |
Attorney, Agent or Firm:
Sakai International Patent Office