Title:
研磨装置
Document Type and Number:
Japanese Patent JP6393489
Kind Code:
B2
Abstract:
The present invention provides a polishing apparatus, which makes use of correctly measuring the thickness of a plate-like work-piece to polish the work-piece to a desired thickness so as to avoid the occurrence of insufficient or excessive polishing. To solve the problem, a thickness calculation unit is used to calculate the thickness of a plate-like work-piece based on the optical path difference between lights reflected from the upper surface and the lower surface of the plate-like work-piece. A radiation thermometer is used to receive the infrared light radiated from the plate-like work-piece so as to measure the temperature of the plate-like work-piece, and a temperature storage unit is used to store the measured temperature from the radiation thermometer. A thickness correction unit calculates the refractive index of the plate-like work-piece based on the temperature stored in the temperature storage unit, and corrects the thickness calculated by the thickness calculation unit based on the calculated refractive index. As a result, while the thickness of the plate-like work-piece is measured and corrected, the plate-like work-piece is polished to the required thickness.
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Inventors:
Shinji Yoshida
Application Number:
JP2014031488A
Publication Date:
September 19, 2018
Filing Date:
February 21, 2014
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B49/04; B24B37/013; B24B49/12; B24B49/14; H01L21/304
Domestic Patent References:
| JP2011143488A | ||||
| JP2011206881A | ||||
| JP1291107A | ||||
| JP5209723A | ||||
| JP2005260038A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
Kyoko Kawamura
Isao Sasaki
Ken Kubo
Kyoko Kawamura
Isao Sasaki
Ken Kubo