Title:
化学機械研磨のための現場終点検出及びプロセス監視の方法並びに装置
Document Type and Number:
Japanese Patent JP5778110
Kind Code:
B2
Abstract:
A chemical mechanical polishing apparatus has a polishing pad (30), a carrier (70) to hold a substrate (10) against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad (30) and carrier head (70) for generating relative motion therebetween. An eddy current monitoring system (40) is positioned to generate an alternating magnetic field in proximity to the substrate (10), an optical monitoring system (140) generates a light beam and detects reflections of the light beam from the substrate (10), and a controller (90) receives signals from the eddy current monitoring system (40) and the optical monitoring system (140).
More Like This:
Inventors:
Hanawa, Hiroji
Johansson, Nills
Swedek, Bogslaw, A.
Birang, Manucha
Redeker, Fritz, Sea.
Bajaju, Rajiv
Johansson, Nills
Swedek, Bogslaw, A.
Birang, Manucha
Redeker, Fritz, Sea.
Bajaju, Rajiv
Application Number:
JP2012221417A
Publication Date:
September 16, 2015
Filing Date:
October 03, 2012
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
G01B7/06; H01L21/304; B24B37/005; B24B37/013; B24B37/04; B24B37/22; B24B37/24; B24B49/00; B24B49/02; B24B49/04; B24B49/10; B24B49/12; G01B7/00; H01L21/283
Domestic Patent References:
| JP2001274126A | ||||
| JP63212804A | ||||
| JP8285515A | ||||
| JP5842902A |
Foreign References:
| US4005359 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation