To provide a polishing ground fabric capable of uniformly polishing a substrate surface without producing a deep scratch on it due to variation of a polishing condition at the time of carrying out precision polishing of texture work, etc., on a surface of a magnetic recording medium, etc.
This ground fabric contains extremely fine fibers of less than 2 μm, water absorbing height on one surface side is more than 20 mm/hour and water absorbing height on the opposite side is less than 5 mm/hour. Preferably, it has a hydrophilic layer on one surface and the layer has thickness of less than 500 μm. Further preferably, the ground fabric is constituted of a fibrous base material and a high molecular polymer and the fiber constituting the fibrous base material is a fiber bundle made by converging more than 20 pieces of the extremely fine fibers.
SUZUKI YOSHIYUKI
KITAWAKI HIDEAKI
