Title:
POLISHING HEAD AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2023127044
Kind Code:
A
Abstract:
To provide a polishing head which enables a polishing tape to be pressed against a substrate, such as a wafer, with a uniform force.SOLUTION: A polishing head 10 includes: a pressing member 12 which presses a polishing tape 2 against a substrate W; an actuator 15 which moves the pressing member 12 in a predetermined pressing direction CL and applies a pressing force to the pressing member 12; and an inclination adjustment mechanism 40 which adjusts an inclination of the pressing member 12 relative to the pressing direction CL. The inclination adjustment mechanism 40 is configured to incline the pressing member 12 relative to the pressing direction CL and maintain an angle of the inclined pressing member 12.SELECTED DRAWING: Figure 6
More Like This:
Inventors:
KASHIWAGI MAKOTO
FUJISAWA MAO
FUJISAWA MAO
Application Number:
JP2022030585A
Publication Date:
September 13, 2023
Filing Date:
March 01, 2022
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B21/00; B24B21/08; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa