Title:
酸化珪素膜用研磨液組成物
Document Type and Number:
Japanese Patent JP7209583
Kind Code:
B2
Abstract:
To provide a polishing liquid composition which materializes reduction of line width dependency of a polishing rate in polishing of an even pattern, and materializes excellent improvement of the polishing rate of a silicon oxide film.SOLUTION: According to one embodiment, a polishing liquid composition for silicon oxide film is provided that contains a cerium oxide particle (component A), a water-soluble polymer (component B), an N-oxide compound (component C) and an aqueous medium, the component B is a water-soluble polymer including a constitutional unit b1 including at least one group selected from a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium group and a salt thereof, and a non-ionic constitutional unit b2, and the component C is an N-oxide compound including a nitrogen-containing heterocyclic aromatic ring skeleton in which at least one hydrogen atom is substituted with a hydroxyl group or a salt thereof.SELECTED DRAWING: None
Inventors:
Satoshi Yamaguchi
Sugawara Masato
Sugawara Masato
Application Number:
JP2019088286A
Publication Date:
January 20, 2023
Filing Date:
May 08, 2019
Export Citation:
Assignee:
Kao Corporation
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2009530848A | ||||
| JP2018512475A | ||||
| JP2013042123A | ||||
| JP2017117898A |
Foreign References:
| US20170236718 |
Attorney, Agent or Firm:
Ikeuchi & Partners Patent Attorney Corporation