Title:
POLISHING LIQUID
Document Type and Number:
Japanese Patent JP2022012737
Kind Code:
A
Abstract:
To provide a polishing liquid capable of improving the polishing rate as compared with a case in which an aqueous solution in which only an inorganic salt showing alkalinity is dissolved by hydrolysis is used as a polishing liquid.SOLUTION: There is provided a polishing liquid that is used when polishing one side of a wafer using a fixed abrasive grain polishing pad with abrasive grains fixed in the pad, and in which inorganic salts showing alkalinity and organic alkali are dissolved by hydrolysis and that do not contain abrasive grains. Preferably, the inorganic salt includes a strong alkaline cation and a weak acid anion, and the organic alkali includes one or more of ammonia, amines, and basic amino acids.SELECTED DRAWING: Figure 1
Inventors:
SAKAI AYUMI
ARIFUKU NORIHISA
SATO TAKESHI
ARIFUKU NORIHISA
SATO TAKESHI
Application Number:
JP2020114784A
Publication Date:
January 17, 2022
Filing Date:
July 02, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B24B7/00; B24B57/02
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano