To carry out inspection whether a subject workpiece is pushed over a workpiece holding member or not at the time of polishing in simple constitution and with high reliability.
In this polishing machine 10, the subject workpiece W is held on the surface of the workpiece holding part 30 as it is pressurized from the back surface side with pressure fluid supplied into a closed space formed on the surface side of the workpiece holding part 30, and closed with the back surface of the subject workpiece, so that it is polished by a polishing pad 21 provided on a pad holding part 20. A pressure fluid supply means 40 is provided with a pressure fluid supply passage 41 connecting a drive part to supply pressure fluid to the closed space 36, a flow meter 43 to detect the flow of pressure fluid in the pressure fluid supply passage 41, and a control part 51 to control driving of both holding parts 20 and 30, based on output signals of the flow meter 43.
SASAKI YUJI
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama
Noriko Yanai
Next Patent: WORKPIECE MACHINING AND HOLDING DEVICE, WORKPIECE MACHINING DEVICE, AND WORKPIECE MACHINING METHOD