To provide a workpiece machining and holding device, and a workpiece machining device which each set a workpiece thereon so as to be capable of machining of surfaces orthogonally adjacent to each other in a predetermined machining direction with an improved machining precision, only by holding the workpiece once, and to provide a workpiece machining method.
According to the workpiece machining and holding device, a holding surface 160 of a holding stand 150 is inclined so as to form a relative angle θ=sin-1(1/31/2) degrees with respect to a rotation axis 120 of a rotary stand 110. Thus the cubic workpiece 10 held on the holding surface 160 can keep a machining direction of each of a first machining surface 11, a second machining surface 12, and a third machining surface 13 set to a predetermined perpendicular direction to each surface whenever the rotation axis 120 of the rotary stand 110 is rotated 120 degrees. In this manner, the machining accuracy of the three machining surfaces of the cubic workpiece 10, which are orthogonally adjacent to each other, can be improved irrespective of the skill of the operator, and further a time period necessary for correcting a holding position of the cubic workpiece is dispensed with, thereby drastically improving the working efficiency.
TADA NORIO
HORI MASAAKI
| JPH08243864A | 1996-09-24 | |||
| JPH0825164A | 1996-01-30 |
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