Title:
POLISHING MATERIAL, AND METHOD OF POLISHING SURFACE OF MULTILAYER WIRING BOARD USING THIS POLISHING MATERIAL
Document Type and Number:
Japanese Patent JP2001353662
Kind Code:
A
Abstract:
To provide the process of polishing a multilayer wiring board with a polishing material and a polishing method in which damage is not given to a wiring board circuit, in which an elongation ratio of a wiring board is low, in which high polishing force is provided, and in which such performance that polishing irregularity will not be generated even when the wiring board has irregularities is provided.
Plural polishing base material each comprising inorganic long fibers bound by resin matrix, and formed to be thin are planted on a support member in such a way that fiber ends of the inorganic long fibers act as polishing parts.
Inventors:
KIKUZAWA KENJI
NAKAYAMA KATSUJI
AKASHI MITSUO
MATSUSHITA TAKASHI
NAKAYAMA KATSUJI
AKASHI MITSUO
MATSUSHITA TAKASHI
Application Number:
JP2000174507A
Publication Date:
December 25, 2001
Filing Date:
June 09, 2000
Export Citation:
Assignee:
XEBEC TECHNOLOGY CO LTD
TAIMEI CHEMICALS CO LTD
TAIMEI CHEMICALS CO LTD
International Classes:
B24B37/20; B24B37/24; B24D3/00; B24D11/00; H05K3/26; H05K3/46; (IPC1-7): B24D11/00; B24B37/00; B24D3/00; H05K3/26; H05K3/46
Domestic Patent References:
| JPH0593336A | 1993-04-16 | |||
| JPH05301172A | 1993-11-16 | |||
| JPH10128669A | 1998-05-19 | |||
| JPH06278039A | 1994-10-04 | |||
| JPH02180562A | 1990-07-13 | |||
| JPH0179560U | 1989-05-29 | |||
| JPH06312378A | 1994-11-08 | |||
| JPH03178775A | 1991-08-02 | |||
| JPS6279695A | 1987-04-13 | |||
| JPH0277192A | 1990-03-16 | |||
| JPH04176136A | 1992-06-23 |
Attorney, Agent or Firm:
Shimizu Yoshi Hiro (2 people outside)
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