To provide a polishing pad with which a stable polishing rate can be obtained and which is superior in inplane uniformity in the polishing pad used for forming a flat face in glass, semiconductor, dielectric/metal complex, an integrated circuit and the like and to provide a polishing apparatus.

In the polishing pad formed of at least a polishing layer and a cushion layer as a first means, micro rubber A hardness of the cushion layer is 50 to 95 and modulus of hysteresis loss at the time of 25% pushing is 10% to 32%. In the polishing pad formed of at least the polishing layer and the cushion layer as the second means, micro rubber A hardness of the cushion layer is 50 to 95, and tanδ of 100 Hz is 0.03 to 0.25. The polishing pad is installed on the polishing apparatus.