Title:
POLISHING PAD FOR PLANARITY
Document Type and Number:
Japanese Patent JP2008254171
Kind Code:
A
Abstract:
To provide a polishing pad which can reduce the variation of the polishing characteristic and the planarity for the operation life of a polishing pad.
The present invention relates to a polishing pad. The polishing pad according to the present invention especially comprises a lower layer, an intermediate layer, and an upper layer which can operate as a polishing layer. The polishing pad according to the present invention is useful for products to be polished, especially for the chemico-mechanical polishing or the planarity of microelectronic devices (for example, semiconductor wafers). The upper layer can absorb abrasive slurry of at least 2 wt.% based on the total weight of the upper layer.
Inventors:
ALLISON WILLIAM C
SWISHER ROBERT
WANG ALAN E
SWISHER ROBERT
WANG ALAN E
Application Number:
JP2008133690A
Publication Date:
October 23, 2008
Filing Date:
May 21, 2008
Export Citation:
Assignee:
PPG IND OHIO INC
International Classes:
B24B1/00; B24B37/22; B24B37/24; B24D11/00; B24D13/12; B24D13/14; B32B5/16; B32B7/12; H01L21/304
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita
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