POLISHING SOLUTION DISTRIBUTION APPARATUS, AND POLISHING APPARATUS HAVING THE SAME

Japanese Patent JP2011230209

A

To provide a polishing solution distribution apparatus that reduces the uneven distribution of a polishing solution even when the leveling during installation is insufficient and the inclination of an installation location varies, and to provide a polishing apparatus having the same.

The polishing solution distribution apparatus 10 includes: a conical branch body 12 that is formed with a solution pan 122 for storing a supplied polishing solution, and also, a plurality of flow passages 121 respectively connected radially to the side surface of the solution pan 122 and each having a delivery port 123 for supplying the polishing solution to a position lower than the connected position; a support portion 11 for supporting the branch body 12; and a universal joint mechanism for supporting the branch body 12 via the support portion 11 at a position higher than the gravity center of the branch body 12.

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JP2662418	INDUSTRIAL APPLICABILITY: A method for manufacturing a magnetic disk and a polishing cloth for that purpose.
JP2003197575	APPARATUS AND METHOD FOR SUPPLYING ABRASIVE

KUROSAWA YOSHIAKI
HASHII TOMOHIRO
KAKIZONO YUICHI

JP2010100922A

November 17, 2011

April 26, 2010

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SUMCO CORP

B24B37/00; B24B37/08; B24B57/02; H01L21/304

JPS5775783A	1982-05-12
JP2002217138A	2002-08-02
JP2001162518A	2001-06-19
JP2008246645A	2008-10-16
JPH0549253U	1993-06-29
JP2001088020A	2001-04-03
JP2003150507A	2003-05-23
JP2002355752A	2002-12-10
JP2007168009A	2007-07-05
JPS5775783A	1982-05-12
JP2002217138A	2002-08-02
JP2001162518A	2001-06-19
JP2008246645A	2008-10-16
JPH0549253U	1993-06-29

Yuichi Murakami
Takahiro Deguchi

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