Title:
研磨ユニット、基板処理装置、および研磨方法
Document Type and Number:
Japanese Patent JP7406980
Kind Code:
B2
Abstract:
An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.
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Inventors:
Akihiro Tanizawa
Kenichi Kobayashi
Makoto Asa Aoi
Kenichi Kobayashi
Makoto Asa Aoi
Application Number:
JP2019233037A
Publication Date:
December 28, 2023
Filing Date:
December 24, 2019
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B49/12; B24B37/10; B24B37/30; B24B55/00; H01L21/304
Domestic Patent References:
| JP11010525A | ||||
| JP11345791A | ||||
| JP2016087713A | ||||
| JP2006128582A | ||||
| JP2003251559A |
Attorney, Agent or Firm:
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Yukio Kanegae
Makoto Watanabe