Title:
POLYAMIDE ACIDS, POLYIMIDES, POLYIMIDE FILMS, AND MULTILAYER FILMS
Document Type and Number:
Japanese Patent JP2023036156
Kind Code:
A
Abstract:
To provide polyimides, polyimide films, and their polyimide precursors that can be used for high-frequency circuit boards, where the dielectric constant and dielectric loss tangent are low and these properties are expressed uniformly, without compromising the basic properties required for FPCs.SOLUTION: Provided is a polyamide acid that is a polyadduct of a tetracarboxylic dianhydride and a diamine compound, containing at least 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as the tetracarboxylic dianhydride, and 2,2'-dimethyl-4,4'-diaminobiphenyl and paraphenylenediamine as the diamine compound. Also provided are a polyimide and a polyimide film obtained therefrom.SELECTED DRAWING: None
Inventors:
FUKUSHIMA NAOKI
AKISADA MASAYA
AKISADA MASAYA
Application Number:
JP2021143018A
Publication Date:
March 14, 2023
Filing Date:
September 02, 2021
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08G73/10; B32B27/34; C08J5/18
Previous Patent: Vacuum processing equipment
Next Patent: Reinforced soil structure and soil structure reinforcement method
Next Patent: Reinforced soil structure and soil structure reinforcement method