Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ポリアミドイミド樹脂、該樹脂を用いた接着剤組成物、該接着剤組成物を用いたプリント回路基板用インク、カバーレイフィルム、接着剤シート及びプリント回路基板
Document Type and Number:
Japanese Patent JPWO2010041644
Kind Code:
A
More Like This:
JPH07164459MANUFACTURE OF LAMINATED PLATE AND MANUFACTURE OF NONWOVEN FABRIC FOR THE SAME PLATE
JP2008308589CURABLE COMPOSITION AND OPTICAL DEVICE USING THE SAME
Inventors:
家根 Takehisa
Tadashi Inukai
Application Number:
JP2009067379W
Publication Date:
March 08, 2012
Filing Date:
October 06, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Toyobo Co., Ltd.
International Classes:
C09J163/00; C09J175/04; C08G18/34; C08G59/40; C09J179/08; C09J11/06; C09J7/02; C08G73/10



 
Previous Patent: 芳香族アルデヒド化合物の製造法

Next Patent: OPERATIONAL AMPLIFIER