Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2002348464
Kind Code:
A
Abstract:

To obtain a novel resin composition excellent in impact resistance by reusing, as it is, waste piece of a base fabric for an air bag using a polyamide fiber.

The polyamide resin composition contains (A) a waste piece of a base fabric for an air bag containing (a1) a polyamide fiber and (a2) a polyolefin film and (B) a compatibilizer for the polyamide and the polyolefin. The mass pts. ratio (a1)/(a2) is 80/20-96/4 and the mass pts. ratio (A)/(B) is 98/2-60/40.


More Like This:
JP3630926POLYMER COMPOSITION AND ITS USE
JP2956982INDUSTRIAL APPLICABILITY [Title of invention] Squeaking noise preventing material
JPH0651802[Title of the Invention] A method for producing a high elastic modulus molded product.
Inventors:
KITAMURA MAMORU
TAMURA TSUTOMU
Application Number:
JP2001153411A
Publication Date:
December 04, 2002
Filing Date:
May 23, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYO BOSEKI
International Classes:
C08J5/00; B29B17/00; C08L77/00; (IPC1-7): C08L77/00; C08J5/00
Domestic Patent References:
JPH05293828A1993-11-09
JPH0531722A1993-02-09
JPH06192570A1994-07-12
JPH02212533A1990-08-23
JPH08283431A1996-10-29
JPS5780452A1982-05-20
JPH06116483A1994-04-26
JPH08170022A1996-07-02
Attorney, Agent or Firm:
Etsushi Kotani (1 person outside)



 
Previous Patent: CURABLE POLYURETHANE COMPOSITION

Next Patent: BIAXIALLY ORIENTED POLYAMIDE FILM