POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF

Title:

POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF

Document Type and Number:

Japanese Patent JP3589314

Kind Code:

B2

Abstract:

PURPOSE: To obtain a polyamide resin composition useful in the production of a molded product having low modulus and being excellent in heat resistance, chemical resistance, moldability, mold release, etc.
CONSTITUTION: This composition is one comprising a polyamide resin and a thermoplastic polyurethane resin, wherein the polyamide resin forms a continuous phase, the thermoplastic polyurethane resin forms a disperse phase, and the tensile modulus of this composition is 7000kg/cm2.

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Inventors:

Tsutomu Tamura
Manabu Takeuchi

Application Number:

JP29683694A

Publication Date:

November 17, 2004

Filing Date:

November 30, 1994

Export Citation:

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Assignee:

TOYO BOSEKI KABUSHIKI KAISHA

International Classes:

C08L75/04; C08L75/00; C08L77/00; (IPC1-7): C08L75/04; C08L77/00

Domestic Patent References:

JP2227459A

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