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Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2015212315
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin composition containing a polyamide resin consisting of a diamine unit mainly containing a xylylenediamine unit and a dicarboxylic acid unit, quick in a crystallization kinetic speed and excellent in direct blow moldability.SOLUTION: There is provided a polyamide resin composition containing a polyamide resin (A) consisting of a diamine unit containing 70 mol% or more of a xylylenediamine unit and a polytetrafluoroethylene-containing mixed powder (B) with the content of the polytetrafluoroethylene-containing mixed powder (B) of 0.05 to 1.0 pts.mass based on 100 pts.mass of the polyamide resin (A).

Inventors:
ISHII KENTARO
KATO TOMONORI
KONO KENJI
Application Number:
JP2014094514A
Publication Date:
November 26, 2015
Filing Date:
May 01, 2014
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L77/06; B65D1/00; C08G69/26; C08L23/18
Domestic Patent References:
JP2000290497A2000-10-17
JP2005537367A2005-12-08
JP2012102189A2012-05-31
JP2013129685A2013-07-04
Foreign References:
WO2011016491A12011-02-10
Attorney, Agent or Firm:
Tamotsu Otani
Wataru Sasaki
Hirasawa Tamano



 
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