Title:
POLYAMIDE RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2014136745
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin molded product which is improved in mechanical characteristics or thermal characteristics and in which cellulose fibers are uniformly dispersed in the polyamide resin without causing aggregation.SOLUTION: There is provided a polyamide resin molded product which is a resin composition containing 0.01 to 50 pts.mass of cellulose fibers having an average fiber diameter of 10 μm or less based on 100 pts.mass of a polyamide resin, wherein the polyamide resin molded product is obtained by forming a resin composition which is obtained by polymerization reaction of a monomer constituting the polyamide resin in the presence of cellulose fibers in a state of containing water.
Inventors:
NAKAI YOSHIO
KIMURA KEISUKE
KIMURA KEISUKE
Application Number:
JP2013005833A
Publication Date:
July 28, 2014
Filing Date:
January 17, 2013
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08J5/00; C08J5/04; C08L1/02; C08L77/00
Domestic Patent References:
| JP2009067817A | 2009-04-02 |
Foreign References:
| WO2011126038A1 | 2011-10-13 |
Attorney, Agent or Firm:
Morimoto International Patent Office
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