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Title:
POLYAMIDE SERIES BINDER FOR METAL POWDER INJECTION MOLDING
Document Type and Number:
Japanese Patent JPH01198405
Kind Code:
A
Abstract:

PURPOSE: To obtain polyamide series binder, which is suitable to injection- molding of metal powder, by mixing the specific polyamide resin and amide compound with the other resin at the specific ratio.

CONSTITUTION: In the case of inspecting variation of weight in N2 with a thermobalance under 5°C/min raising temp. to 50mg sample as the binder for injection-molding the metal powder, 20W60wt.% one or more kinds of the polyamide resin, whose temp. for 50wt.% loss is 350W470°C, to the whole and in the variation of weight in N2 with the thermobalance under 5°C/min raising temp. to 50mg sample, 20W60wt.% one or more kinds of the amide compound, whose temp. for 50wt.% loss is 150W350°C and molecular wt. is 135W600, to the whole, and ≥60% the total of the above raw materials are to use to the whole and ≤40% the balance resin except the above raw materials may be used. By using the above composite mixed material as the binder for injection- molding the metal powder, the shape keeping property after injection-molding and even at the time of degreasing is improved.


Inventors:
ONO YUTAKA
SAITO KATSUYOSHI
YATSUGAMI HARUO
SAIKI TAKEO
MASUDA YOSHIMICHI
Application Number:
JP2447788A
Publication Date:
August 10, 1989
Filing Date:
February 04, 1988
Export Citation:
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Assignee:
SANWA KAGAKU KOGYO KK
International Classes:
C08L77/00; B22F1/10; B22F1/103; B22F3/02; B22F3/22; C08K5/20; C08K5/3462; (IPC1-7): B22F3/02; C08K5/20; C08L77/00
Attorney, Agent or Firm:
Minoru Nakamura (4 outside)