Title:
ポリアミドイミド樹脂組成物、フッ素塗料、及び導電性組成物
Document Type and Number:
Japanese Patent JP7226507
Kind Code:
B2
Abstract:
To provide a polyamide-imide resin composition that contains a solvent that can dissolve a polyamide-imide resin and can improve the work environment, and has excellent storage stability and resists deterioration of its properties.SOLUTION: A polyamide-imide resin composition contains (A) polyamide-imide resin, (B) N-ethyl-2-pyrrolidone, (C) water, and (D) a basic compound, where when it is stored for 7 days at 60°C, a viscosity change rate before and after the storage is within -30%.SELECTED DRAWING: None
Inventors:
Atsushi Takahashi
Application Number:
JP2021181234A
Publication Date:
February 21, 2023
Filing Date:
November 05, 2021
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C08G73/14; C08L79/08; C08K3/01; C08K5/17; C08L27/12; C09D127/12; C09D179/08
Domestic Patent References:
| JP2010508427A | ||||
| JP2017511389A | ||||
| JP2015199858A | ||||
| JP2006008848A | ||||
| JP2012172130A | ||||
| JP2016089016A | ||||
| JP2014181332A | ||||
| JP2015522660A | ||||
| JP2004310017A |
Foreign References:
| WO2016098336A1 | ||||
| US5955568 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Previous Patent: Information provision system, information provision method, and program
Next Patent: SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Next Patent: SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF