ポリベンゾオキサゾール前駆体、絶縁材用樹脂組成物およびこれを用いた絶縁材

Title:

ポリベンゾオキサゾール前駆体、絶縁材用樹脂組成物およびこれを用いた絶縁材

Document Type and Number:

Japanese Patent JP4004004

Kind Code:

B2

More Like This:

JPH0730482	[Title of Invention] Fiber
WO/2010/010842	POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM
WO/2017/003173	POLYIMIDE-POLYBENZOXAZOLE PRECURSOR SOLUTION, POLYIMIDE-POLYBENZOXAZOLE FILM, AND PREPARATION METHOD THEREFOR

Inventors:

Naofumi Enoki
Toshimasa Eguchi
Murayama Sanmoto
Murata Mitsuru

Application Number:

JP2000017724A

Publication Date:

November 07, 2007

Filing Date:

January 26, 2000

Export Citation:

Assignee:

Sumitomo Bakelite Co., Ltd.

International Classes:

C08G73/22; H01L21/312; H01B3/30

Domestic Patent References:

Previous Patent: 転写装置及び画像形成装置

Next Patent: 現像装置及びこれを用いる画像形成装置