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Title:
POLYESTER RESIN FOR HOLLOW MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2000226500
Kind Code:
A
Abstract:

To obtain a polyester resin excellent in clarity and high-temperature dimensional stabilty by incorporating a metal compound selected from among solubilized Mg compounds, Ca compounds, Co compounds, Mn compounds, and Zn compounds; a P compound; and an Sb compound and a Ti compound and/or a Ge compound, each in a specified amount, into a polyester resin mainly comprising repeating ethylene terephthalate units.

At least one metal compound selected from among solubilized Mg compounds, Ca compounds, Co compounds, Mn compounds, and Zn compounds; a P compound; and an Sb compound and a Ti compound and/or a Ge compound are incorporated in such amounts as to satisfy the formulas: 0.1≤M≤5, 0.1≤M/P≤2, 0.1≤Sb≤1.7, 0≤Ti≤0.4, and 0≤Ge≤0.7. In the formulas, M is the number of moles of the at least one metal compound selected from among Mg compounds, Ca compounds, Co compounds, Mn compounds, and Zn compounds contained in a solubilized state in 1 ton of the polymer; and P, Sb, Ti, and Ge are the numbers of moles of the P compound, the Sb compound, the Ti compound, and the Ge compound, respectively, contained each in a solubilized state.


Inventors:
NINOMIYA HIDETOSHI
KIKUCHI SHOJI
ETO YOSHITAKA
Application Number:
JP2782299A
Publication Date:
August 15, 2000
Filing Date:
February 04, 1999
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
C08K3/10; C08G63/183; C08G63/86; C08K3/22; C08K5/098; C08L67/02; (IPC1-7): C08L67/02; C08G63/183; C08G63/86; C08K3/10; C08K3/22; C08K5/098