Title:
POLYESTER RESIN FOR MOLDING, RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED BY USING THE SAME
Document Type and Number:
Japanese Patent JP3553559
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyester resin or resin composition for the molding of electric or electronic parts having complicate shapes and sufficiently satisfying various properties such as waterproofness, electrical insulation, working environment, productivity and durability.
SOLUTION: The saturated polyester resin for molding has a melt viscosity of 5-1,000 dPas at 200°C and an a×b value of ≥500 wherein (a) (N/mm2) is the tensile strength at break of a film molded by the resin and (b) (%) is the tensile elongation at break. The invention further relates to a molded article produced by using the resin.
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Inventors:
Mitsuo Nishida
Osamu Iriya
Osamu Iriya
Application Number:
JP2002263187A
Publication Date:
August 11, 2004
Filing Date:
September 09, 2002
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
C08J5/00; C08G63/181; C08G63/183; C08L67/02; H01L23/29; H01L23/31; (IPC1-7): C08G63/183; C08L67/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP7070535A | ||||
| JP2000128966A |
Other References:
湯木 和男,飽和ポリエステル樹脂ハンドブック,日本,日刊工業新聞社,1989年12月22日,第568頁
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