Title:
POLYIMIDE COATING FILM
Document Type and Number:
Japanese Patent JP2016094522
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide coating film having low dielectric constant and high tensile elongation.SOLUTION: There is provide a polyimide coating film formed on a substrate and the polyimide consists of polyimide containing pyromellitic acid (PMA) as a tetracarboxylic acid component, 4,4'-oxydianiline (ODA) as a diamine component and 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP); and a solvent having the boiling point of 200°C or less at normal pressure remains in the polyimide with its solvent residual ratio of 1 mass% to 3 mass% to the mass of the polyimide coating film.SELECTED DRAWING: None
Inventors:
SHIGETA AKIRA
YOSHIDA TAKESHI
YAMADA HIROKI
MORIKITA TATSUYA
YAMADA MUNENORI
HOSODA MASAHIRO
ECHIGO YOSHIAKI
YOSHIDA TAKESHI
YAMADA HIROKI
MORIKITA TATSUYA
YAMADA MUNENORI
HOSODA MASAHIRO
ECHIGO YOSHIAKI
Application Number:
JP2014230808A
Publication Date:
May 26, 2016
Filing Date:
November 13, 2014
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C09D179/08; C08G73/10; H01B17/60
Domestic Patent References:
| JPS63221126A | 1988-09-14 |
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