To provide a polyimide metal laminate which is used as a two-layer flexible substrate having excellent heat resistance and has excellent connection reliability when bent in electronic equipment and to provide a printed wiring board obtained by using the polyimide metal laminate.

The polyimide metal laminate 1 includes: a non-thermoplastic polyimide film 13; an adhesive polyimide layer 14 arranged on at least one side of the non-thermoplastic polyimide film 13; and a metal layer 12 arranged on the adhesive polyimide layer 14. The non-thermoplastic polyimide film 13 has ≤4 GPa elastic modulus, the adhesive polyimide layer 14 has 1-3 μm thickness and the metal layer 12 has ≤1.0 μm ten-point average roughness Rz on the contact surface abutted on the adhesive polyimide layer 14.