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Title:
ポリイミド樹脂、その製造方法、接着剤樹脂組成物、カバーレイフィルム及び回路基板
Document Type and Number:
Japanese Patent JP5100894
Kind Code:
B2
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Inventors:
Ryo Mori
Yoshiki Sudo
Koji Nakamura
Application Number:
JP2011547438A
Publication Date:
December 19, 2012
Filing Date:
December 02, 2010
Export Citation:
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Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
C08G73/10; C09J5/06; C09J7/02; C09J179/08
Domestic Patent References:
JP2009029982A2009-02-12
JP2008291063A2008-12-04
JP2006104447A2006-04-20
JP2001089656A2001-04-03
JPH0895251A1996-04-12
JP2001247819A2001-09-14
JP2007043023A2007-02-15
JP2009029982A2009-02-12
JP2008291063A2008-12-04
JP2006104447A2006-04-20
JP2001089656A2001-04-03
JPH0895251A1996-04-12
JP2001247819A2001-09-14
JP2007043023A2007-02-15
Foreign References:
WO2007052540A12007-05-10
WO2007052540A12007-05-10
Attorney, Agent or Firm:
Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa



 
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