Title:
POLYIMIDE VARNISH, METHOD FOR PRODUCING POLYIMIDE FILM, AND METHOD FOR PRODUCING PATTERNED POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2022073126
Kind Code:
A
Abstract:
To provide a polyimide varnish which gives a polyimide film that is obtained by dissolving a polyimide resin in an organic solvent and is excellent in dielectric characteristics in a high-frequency band, a method for producing a polyimide film using the polyimide varnish, and a method for producing a patterned polyimide film using the polyimide varnish.SOLUTION: A polyimide resin having a biphenyl skeleton having a structure represented by the following formula (A1) in a constitutional unit constituting a main chain is easily dissolved in an organic solvent, and a polyimide varnish can be prepared. In the formula (A1), X1 and X2 are each independently a divalent organic group, Y1 is a tetravalent organic group, Ra1 and Ra2 are each independently an alkyl group having 1 or more and 4 or less carbon atoms, an alkoxy group having 1 or more and 4 or less carbon atoms, or a halogen atom, and n1 and n2 are each independently an integer of 0 or more and 4 or less.SELECTED DRAWING: None
Inventors:
EBISAWA KAZUAKI
Application Number:
JP2020182914A
Publication Date:
May 17, 2022
Filing Date:
October 30, 2020
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
C08G73/10; C08F299/00; H05K1/03
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Kazuyoshi
Hayashi Kazuyoshi