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Title:
高分子組成物、コーティングワニス、樹脂膜および半導体装置
Document Type and Number:
Japanese Patent JP4345614
Kind Code:
B2
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Inventors:
Yumiko Yamamoto
Yukiharu Ono
Naofumi Enoki
Application Number:
JP2004244401A
Publication Date:
October 14, 2009
Filing Date:
August 24, 2004
Export Citation:
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Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G85/00; C08G61/00; C08L101/02; C09D5/25; C09D165/00; C09D171/12; C09D181/06; C09D187/00; C09D201/02; H01L23/29; H01L23/31
Domestic Patent References:
JP2003277508A
JP2003105085A
JP2005163002A
JP2005281426A



 
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