Title:
POLYMER COMPOUND, RESIST MATERIAL, AND PROCESS FOR FORMING PATTERN
Document Type and Number:
Japanese Patent JP3874092
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resist material which is sensitive to high-energy rays and excellent in the sensitivity at a wave length of 200 nm or less, especially of 170 nm or less.
SOLUTION: The polymer compound contains repeating units expressed by formulae (1a) and (1b) (wherein R1 and R2 are each H, F, an alkyl group or a fluorinated alkyl group; R3 is F or a fluorinated alkyl group; R4 is an acid unstable group, a tightly junctioning group or a fluorinated alkyl group; R5 is an oxygen atom or a sulfur atom; R6a, R6b, R6c and R6d are each H, OH, -(CH2)dC(R7)2(OR8), -(CH2)dCO2R8, an alkyl group or a fluorinated alkyl group, but R7 is H, F, or a fluorinated alkyl group and R8 is H, an acid unstable group, a tightly junctioning group or a fluorinated alkyl group; and 0<a<1, 0<b<1, 0<a+b≤1, c=0 or 1, and 0≤d≤6).
Inventors:
Yuji Harada
Jun Hatakeyama
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Kazuhiko Maeda
Mitsutaka Otani
Haruhiko Komoriya
Jun Hatakeyama
Yoshio Kawai
Masako Sasako
Masataka Endo
Kishimura Shinji
Kazuhiko Maeda
Mitsutaka Otani
Haruhiko Komoriya
Application Number:
JP2001393302A
Publication Date:
January 31, 2007
Filing Date:
December 26, 2001
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
Matsushita Electric Industrial Co., Ltd
Central Glass Co., Ltd.
Matsushita Electric Industrial Co., Ltd
Central Glass Co., Ltd.
International Classes:
C08F220/10; C08F234/00; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): C08F220/10; C08F234/00; G03F7/039; H01L21/027
Domestic Patent References:
| JP2003040931A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa