To provide a radiation sensitive resin composition exhibiting very high sensitivity to light for exposure such as far UV, excimer laser light or an electron beam, having excellent adhesion to a substrate, and which is less liable to cause pattern peeling or swelling in development and to provide a polarity change type polymer exhibiting excellent characteristics as the base resin of the radiation sensitive resin composition and a new polymerizable compound used in formation of the polymer.
The polymerizable compound is represented by formula (I). The polymer includes 5-100 mol% structural units represented by formula (II) and 0-95 mol% structural units derived from another vinyl monomer and has a weight average molecular weight in the range of 1,000-100,000. The radiation sensitive resin composition comprises the polymer (a) and a compound (b) which generates an acid upon irradiation with an active ray.
YOSHINO YASUSHI
OZAWA KAKUEI
