Title:
ポリオルガノシロキサン組成物およびその硬化体
Document Type and Number:
Japanese Patent JP5429968
Kind Code:
B2
Abstract:
To provide a polyorganosiloxane composition with a high heat resistivity and a low load given to the environment and to provide its cured body.
The polyorganosiloxane composition includes (A) a polyorganosiloxane in which at least one end in the molecule is a polyorgano-siloxane modified with silanol, (B) 0.3-3 mol of a silicon alkoxide per mol of the organosiloxane, as a crosslinking agent for crosslinking the polyorganosiloxane, and (C) 0.05-2 mol of hydroxyacetone per mol of the polyorganosiloxane.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
Shuhei Nakamura
Hiroaki Naga
Fumito Sano
Yasushi Murakami
Shimizu
Kazuyo Miyata
Hiroaki Naga
Fumito Sano
Yasushi Murakami
Shimizu
Kazuyo Miyata
Application Number:
JP2009153639A
Publication Date:
February 26, 2014
Filing Date:
June 29, 2009
Export Citation:
Assignee:
Mie University
Shinshu University
Japan Science and Technology Agency
Shinshu University
Japan Science and Technology Agency
International Classes:
C08L83/06; C08G77/14; C08K5/07; C08K5/10; C08K5/5415
Domestic Patent References:
| JP2002080816A | ||||
| JP7304953A | ||||
| JP63061052A |
Foreign References:
| WO2001081474A1 | ||||
| WO2010047109A1 |
Attorney, Agent or Firm:
Hiroshi Hasegawa
Tomoko Nakatani
Tomoko Nakatani
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