PURPOSE: To provide a resin composition containing respective specific polyparabanic acid polymer, aromatic polysulfone and organic solvent at specific ratios, having excellent slipperiness, heat-resistance and moldability and useful for film for flexible printed circuit board, etc.
CONSTITUTION: The resin composition contains (A) 100 pts.wt. of a polyparabanic acid polymer containing the recurring unit of formula I (R is bivalent organic group) and having a reduced viscosity of 0.2-10dl/g measured in DMF at 30°C) at a concentration of 0.5g/dl, (B) 0.01-50 pts.wt. of an aromatic polysulfone containing the recurring unit of formula II and having a reduced viscosity of 0.35-0.6dl/g measured in DMF at 30°C) at a concentration of 1g/dl and (C) one or more kinds of organic solvents selected from DMF, dimethylacetamide, N-methylpyrrolidone and dimethyl sulfoxide. The content of the resin component consisting of the components A and B in the composition is 2-40wt.%.
FUKAI TOMOHIRO
NAKAYAMA YASUSHI
