Title:
POLYPROPYLENE RESIN EAXPANDED MOLDING AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3556133
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain expandable beads that have a small density, are uniform and can be controlled with respect to the heat resistance to steam, and expanded moldings, modified resin particles for expansion and expandable resin particles used to obtain the beads.
SOLUTION: The modified polypropylene resin particles can be obtained by thermally treating polypropylene resin particles mainly composed of a propylene copolymer with ethylene and (or) other type of olefin, wherein the modified polypropylene resin particles have a main heat absorption peak temperature of a DSC curve, which is obtained by measurement through a scanning differential calorimetry, is higher by 5°C or more than a main heat absorption peak temperature of the polypropylene resin particles prior to the heat treatment.
Inventors:
Hiroyuki Yamagata
Application Number:
JP27966299A
Publication Date:
August 18, 2004
Filing Date:
September 30, 1999
Export Citation:
Assignee:
Sekisui Plastics Co., Ltd.
International Classes:
C08J3/12; C08J9/18; (IPC1-7): C08J9/18
Domestic Patent References:
| JP3002890B2 | ||||
| JP7090104A |
Attorney, Agent or Firm:
Shintaro Nogawa
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