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Title:
POSITIONING GUIDE AND IC SOCKET
Document Type and Number:
Japanese Patent JP3688239
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a positioning guide allowing a highly accurate package housing part to be easily formed therein.
SOLUTION: The positioning guide 16 comprises two body members 17 and 18, and a depressing extent limiting member 19. The body members 17 and 18 have recessed parts 17a and 18a formed therein respectively, with cutouts 17b and 18b formed therein respectively. The body members 17 and 18 are stuck together with the limiting member 19 sandwiched between them and fixed with screws (with illustrations left out). In this state, a package housing part 21 comprising the cutouts 17b and 18b is formed with a package supporting surface 19 of the limiting member 19 disposed in a lower position of the housing part 21. Since the cutouts 17b and 18b can be formed by means of cutting which facilitates work with higher accuracy than boring, the cutouts 17b and 18b can be formed with high accuracy, and furthermore, the housing part 21 can be formed with high accuracy.


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Inventors:
Previous Katsuchi
Application Number:
JP2002018192A
Publication Date:
August 24, 2005
Filing Date:
January 28, 2002
Export Citation:
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Assignee:
株式会社リコー
International Classes:
H01L23/32; H01R33/76; G01R31/26; (IPC1-7): G01R31/26; H01L23/32; H01R33/76
Domestic Patent References:
JP11185911A
JP2001083207A
JP2000156269A
JP9148017A
JP63016586A
JP62175683U
Attorney, Agent or Firm:
Shigeo Noguchi