To obtain the positive photosensitive composition high in sensitivity to deep ultraviolet rays, especially, ArF excimer laser beams by incorporating a specified compound and a resin.
This positive photosensitive composition contains the compound to be allowed to produce an acid by irradiation with activated rays or radiation and the resin having divalent polycyclic alicyclic units each represented by the formula in which X is a divalent bonding group of an O or S atom or a -NHSO2 group or the like; R1 is an H atom or an alkyl group or a group releasable by an acid or a -Y-R3 group; Y is a simple bond or a divalent bonding group or that of a combination of ≥2 groups; R2 is an H atom or an methyl group; R3 is a -COOH, -COOR4, hydroxy group or the like; and R4 is an optionally substituted alkyl group or the like. The use of this composition permits the obtained positive photosensitive composition to have high transmittance, especially, to far ultraviolet rays of ≤220 nm and superior in dry etching resistance.
SATO KENICHIRO
AOSO TOSHIAKI
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