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Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION OF RELIEF PATTERN USING THE SAME, AND PRODUCTION OF POLYIMIDE PATTERN
Document Type and Number:
Japanese Patent JPH10228110
Kind Code:
A
Abstract:

To obtain a resin compsn. which can be easily produced and shows excellent stability in viscosity and which enables formation of a good image by incorporating a photoacid producing agent, a solvent and a complex prepared from a basic compd. and a polyimide which is soluble with an org. solvent.

This compsn. contains a photoacid producing agent, a solvent and a complex prepared from a basic compd. and a polyimide which is soluble with an org. solvent. This photosensitive resin compsn. is applied by dip coating, spray coating and the like on a substrate such as a silicon wafer and a metal substrate, and properly dried by heating to remove the solvent to form a film having no adhesion property. Then the coating film is irradiated with active rays or chemical rays through a mask having a desired pattern. Since an acid is produced by irradiation, the solubility in the irradiated part increases. Therefore, by dissolving and removing the irradiated part with a developer, a desired positive pattern can be obtd. Thus, the compsn. can be easily produced. has excellent viscosity stability, and enables formation of a good image.


Inventors:
HAGIWARA HIDEO
Application Number:
JP3152697A
Publication Date:
August 25, 1998
Filing Date:
February 17, 1997
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/004; G03F7/037; G03F7/039; G03F7/40; H01L21/027; H01L21/312; (IPC1-7): G03F7/039; G03F7/004; G03F7/037; G03F7/40; H01L21/027; H01L21/312
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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