Title:
POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2010055083
Kind Code:
A
Abstract:
To provide a positive photosensitive composition improved in sensitivity, low development defects, exposure latitude (EL), depth of focus (DOF) performance, shape, mask error enhancement factor (MEEF) performance, resolution and line-width roughness (LWR), and a pattern forming method using the same.
The positive resist composition includes (A) a resin which includes at least a repeating unit having a lactone structure and a repeating unit derived from hydroxystyrene, and which is decomposed by the action of an acid to increase solubility in an alkali developer, and (B) a compound which generates an acid upon irradiation with actinic rays or radiation. The pattern forming method using the same is also provided.
Inventors:
SUGIYAMA SHINICHI
HIRANO SHUJI
YOKOYAMA SHIGEO
HIRANO SHUJI
YOKOYAMA SHIGEO
Application Number:
JP2009178459A
Publication Date:
March 11, 2010
Filing Date:
July 30, 2009
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G03F7/039; C08F220/26; G03F7/004; H01L21/027
Domestic Patent References:
| JP2008031298A | 2008-02-14 | |||
| JP2004210917A | 2004-07-29 | |||
| JP2005352466A | 2005-12-22 | |||
| JP2006301609A | 2006-11-02 | |||
| JP2005352278A | 2005-12-22 | |||
| JP2005534956A | 2005-11-17 | |||
| JP2006171568A | 2006-06-29 | |||
| JP2006011250A | 2006-01-12 | |||
| JP2009157338A | 2009-07-16 | |||
| JP2008031298A | 2008-02-14 | |||
| JP2004210917A | 2004-07-29 | |||
| JP2005352466A | 2005-12-22 |
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa